Thermal Modeling of Nanoscale Transistors (Thermonat)
Application Deadline: June 15, 2023
The Defense Advanced Research Projects Agency (DARPA) is issuing a Microsystems Exploration topic (µE) inviting submissions of innovative basic or applied research concepts in the technical domain of multi-scale thermal management. This µE is issued under the Program Announcement for Microsystems Exploration, DARPA-PA-21-05. All proposals in response to the technical area(s) described herein will be submitted to DARPA-PA-21-05-05 and if selected, will result in an award of an Other Transaction (OT) for prototype project not to exceed $1,000,000.
Disruptioneering Program Announcement
Due Date: June 20, 2023
The mission of the Defense Advanced Research Projects Agency (DARPA) Defense Sciences Office (DSO) is to identify and create the next generation of scientific discovery by pursuing high-risk, high-payoff research initiatives across a broad spectrum of science and engineering disciplines and transforming these initiatives into disruptive technologies for U.S. national security. As part of this mission, DSO makes high-risk, high-reward investments in science and technology that have the potential to disrupt current understanding and/or approaches. The pace of discovery in both science and technology is accelerating worldwide, resulting in new fields of study and the identification of scientific areas ripe for disruption. In order to capitalize on these new opportunities, DSO looks to include rapid, targeted and limited scope investments as part of an overall balanced portfolio. DSO solicits these accelerated investments through our Disruptioneering program. Disruptioneering enables DARPA to initiate a new investment in less than 120 calendar days from idea inception.
High Operational Temperature Sensors (HOTS)
Abstract Due Date: June 22, 2023
The High Operational Temperature Sensors (HOTS) program will develop high-bandwidth, high-dynamic-range analog sensor microelectronics technologies that operate at high-temperature. HOTS will demonstrate a pressure sensor module consisting of integrated transducer and signal-conditioning microelectronics.
