Georgia Tech Packaging Research Center Launches Industry Advisory Board

The Georgia Tech 3D Systems Packaging Research Center (PRC) – the largest and most comprehensive microsystems packaging research, education, and industry collaboration center in the world – has formed its first Industry Advisory Board. The board will consist of global leaders in electronics manufacturing and packaging who will work closely with PRC Director Madhavan Swaminathan to expand the Center’s reach and collaborations.

“The PRC is in a unique position as semiconductor packaging takes center stage to continue Moore's law,” said Swaminathan, who is also the John Pippin Chair in Microsystems Packaging in the School of Electrical and Computer Engineering and Materials Science and Engineering at Georgia Tech. “The members of the advisory board are trail blazers in electronic packaging, and their collective experience and wisdom will help us strategize on future technologies and activities at the PRC. With their help, we expect to increase our reach around the world.”

Inaugural members of the PRC Industry Advisory Board include Shekhar Chandrashekhar, Chief Executive Officer, iNEMI; Andrew Ketterson, Research Fellow, Qorvo; Ravi Mahajan, Intel Fellow, Assembly and Test Technology Pathfinding, Intel; Omkaram Nalamasu, Senior Vice President and Chief Technology Officer Applied Materials, Inc., and President, Applied Ventures, LLC; Georgia Tech Professor Rao Tummala, former PRC Director and Professor Emeritus, and Douglas Yu, TSMC Distinguished Fellow and Vice President, Pathfinding for System Integration, Taiwan Semiconductor Manufacturing Co.

The initial mission of the Advisory Board will include the following:

  • Recommending emerging applications that drive important metrics for packaging.
  • Assessing current PRC technologies and identifying areas not covered.
  • Suggesting important relationships that PRC needs to develop and enabling them.
  • Recommending new emerging opportunities.

The PRC is a graduated National Science Foundation Engineering Research Center focused on advanced packaging and system integration leading to System on Package technologies. The Center conducts research, supports education, and is building the workforce of the future in all aspects of packaging, including design, materials, process, assembly, reliability, thermal management, and systems integration driven by emerging applications. The emerging applications currently include high-performance computing, automotive, healthcare, and broad band wireless. The PRC team consists of 29 faculty from five schools, 11 research/administrative staff, more than 60 graduate/undergraduate students, and several visiting engineers. The PRC currently collaborates with 48 industry and government organizations, and 14 universities.

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