The FlexAL atomic layer deposition (ALD) system offers a broad range of optimized high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber.

Features include:

• Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber
• RF biased electrode option available for control of film properties
• Industry-standard cassette to cassette handling for higher throughput
• Maximum flexibility in the choice of precursors, process gases, hardware features and options
• Optimized to maintain low-damage, high-quality substrates
• Removable liners allow for easy chamber maintenance
• Low temperature to enable high-quality deposition on temperature-sensitive surfaces