The Veeco Fiji G2 Atomic Layer Deposition (ALD) System is a modular, high-vacuum ALD system that can accommodate a wide range of deposition modes using a flexible architecture and multiple configurations of precursors and plasma gases. The Fiji G2 is a next-generation ALD system capable of performing thermal and plasma-enhanced deposition. It has advanced features including a proprietary chamber turbo pumping system, fast process time, and improved plasma design.

The Veeco Fiji G2 ALD System has a 200 mm (8”) chuck with fully automatic loading and unloading function. The process temperature can be up to 500°C, and plasma power up to 300 W. The layer thickness can be controlled in angstrom resolution, and non-uniformity is within 1%. It can generate high quality oxide and nitride films for semiconductor manufacturing, MEMS, solar cells, etc.