The Disco Automatic Dicing Saw (DAD 3361) is an automated dicing saw that can handle 12-inch wafers and smaller substrates. The common blades are 80um thick and can cut glass and silicon substrates up to about 1mm thickness.  For FR4, sapphire and other materials, special purpose blades can be used. The DAD3361 is commonly used to cut silicon wafers, but can also handle products of a variety of sizes and materials, such as large package substrates, electronic parts including SAW filters, and more. It has a wide selection of options available to improve processing quality to reduce running costs and improve its ability to process hard-to-cut materials.  Alternative uses of the system can include the creation of trenches or scribing lines on substrates to aid in subsequent separation of small dies.  The system also incorporates a semiautomatic and automatic alignment system to allow researchers at various levels of training successful use of the system.  Substrates to be cut on the system are affixed to the dicing frame and chuck table with a UV release tape to allow for a strong adhesion during dicing and easier removal of diced substrates after the dicing process.