Muhannad S. Bakir

Muhannad S. Bakir

Dan Fielder Professor; School of Electrical & Computer Engineering

Muhannad S. Bakir is the Dan Fielder Professor in the School of Electrical and Computer Engineering at Georgia Tech.  Dr. Bakir and his research group have received more than thirty paper and presentation awards including six from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir’s group was awarded 2014 and 2017 Best Papers of the IEEE Transactions on Components Packaging and Manufacturing Technology (TCPMT). Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. Dr. Bakir is the co-recipient of the 2018 IEEE Electronics Packaging Society (EPS) Exceptional Technical Achievement Award "for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies." He is also the co-recipient of the 2018 McKnight Foundation Technological Innovations in Neuroscience Awards. In 2020, Dr. Bakir was the recipient of the Georgia Tech Outstanding Doctoral Thesis Advisor Award.  
Dr. Bakir serves on the editorial board of IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT) and IEEE Transactions on Electron Devices (TED). Dr. Bakir serves as a Distinguished Lecturer for IEEE EPS.


Office Location:
Marcus 4135

Integrated 3D Systems Group @ GT

  • ECE Profile Page

  • Georgia Institute of Technology

    College of Engineering
    School of Electrical and Computer Engineering
    Research Focus Areas:
  • Advanced Composites
  • Computer Engineering
  • Electronics
  • Flexible Electronics
  • Micro and Nano Device Engineering
  • Miniaturization & Integration
  • Optics & Photonics
  • Semiconductors
  • Additional Research:
    • Advanced cooling and power delivery for emerging system architectures
    • Biosensor technologies and their integration with CMOS
    • Electrical and photonic interconnect technologies
    • Heterogeneous microsystem design and integration, including 2.5D and 3D ICs and packaging
    • Nanofabrication technologies

    IRI Connection: