Madhavan Swaminathan

Madhavan Swaminathan

Professor; School of Electrical & Computer Engineering
John Pippin Chair in Microsystems Packaging & Electromagnetics; School of Electrical & Computer Engineering
Director: 3D Systems Packaging Research Center (PRC)

Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Research Center, Georgia Tech. Prior to joining Georgia Tech, he was with IBM working on packaging for supercomputers. He is the author of 450+ refereed technical publications, holds 30 patents, primary author and co-editor of 3 books (Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007, Introduction to System on Package, McGraw Hill, 2008 and Design and Modeling for 3D ICs and Interposers, WSP, 2013), founder and co-founder of two start-up companies (E-System Design and Jacket Micro Devices) and the founder of an international IEEE conference (Electrical Design of Advanced Packaging and Systems - EDAPS). His research work has been recognized through several awards including 19 best paper and best student paper awards, 2017 Outstanding Achievement in Research Program Development Award, Georgia Tech, 2014 Distinguished Alumnus Award from NITT (India), 2014 Outstanding Sustained Technical Contribution Award from IEEE CPMT Society, 2007 Technical Excellence Award from Semiconductor Research Corporation, 2003 Outstanding Faculty Leadership Award for the advisement of GRAs, Georgia Tech, 2002 Outstanding Faculty Advisor Award from ECE, Georgia Tech and IBM Outstanding Faculty Award in 2004 and 2005. He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE EMC society. Forty one Ph.D. and Eighteen MS students have graduated under his supervision. He received his BE Degree in Electronics and Communication from Regional Engineering College, Tiruchirapalli (now NITT) in 1985 and MS and Ph.D. degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.


Office Location:
Pettit/MiRC 109

3D Systems Packaging Research Center (PRC)

  • ECE Profile Page
  • Google Scholar

    Georgia Institute of Technology

    College of Engineering
    School of Electrical and Computer Engineering
    Research Focus Areas:
  • Flexible Electronics
  • Miniaturization & Integration
  • Additional Research:
    • Numerical methods in electromagnetics
    • Mixed signal design
    • Signal, power, and thermal integrity
    • Power delivery
    • IC-Package Co-design

    IRI Connection: