Seung-Kyum Choi directly began at Georgia Tech in Fall 2006 as an assistant professor. Prior to joining Georgia Tech, he was a research assistant at Wright State University, conducting research on uncertainty quantification techniques for the analytical certification of complex engineered systems.  

Zhu's research focuses on the modeling and simulation of mechanical behavior of materials at the nano- to macroscale. Some of the scientific questions he is working to answer include understanding how materials fail due to the combined mechanical and chemical effects, what are the atomistic mechanisms governing the brittle to ductile transition in crystals, why the introduction of nano-sized twins can significantly increase the rate sensitivity of nano-crystals, and how domain structures affect the reliability of ferroelectric ceramics and thin films. To address these problems, which involve multiple length and time scales, he has used a variety of modeling techniques, such as molecular dynamics simulation, reaction pathway sampling, and the inter-atomic potential finite-element method. The goal of his research is to make materials modeling predictive enough to help design new materials with improved performance and reliability.

Xia began at Georgia Tech in Fall 2011. Prior to joining Georgia Tech, he was a postdoctoral researcher at the Graduate Aerospace Laboratories of the California Institute of Technology (CALCIT).

Streator’s research is concerned with the interactions between contacting surfaces, with particular emphasis on the roles played by surface roughness and by intervening liquid films. Much of this research is motivated by problems of adhesion or “stiction” that is prevalent in small-scale devices such as microelectromechanical systems (MEMS) and in the head-disk interface of computer disk drives. As device form factors continue to shrink the role of surface forces, such as liquid surface tension become increasingly dominant as compared to inertial forces. In this regard Streator has been interested in developing models that consider the interplay between liquid-drive capillary stresses and elastic restoring forces. This work has led to models of contact instabilities force generation predictions for both smooth and rough interfaces.

Antoniou started with the Woodruff School in Fall 2008. Prior, she worked as a postdoctoral research associate at the Center for Integrated Nanotechnlogies (CINT) at Los Alamos National Laboratory.

Neu's research involves the understanding and prediction of the fatigue behavior of materials and closely related topics, typically when the material must resist degradation and failure in harsh environments. Specifically, he has published in areas involving thermomechanical fatigue, fretting fatigue, creep and environmental effects, viscoplastic deformation and damage development, and related constitutive and finite-element modeling with a particular emphasis on the role of the materials microstructure on the physical deformation and degradation processes. He has investigated a broad range of structural materials including steels, titanium alloys, nickel-base superalloys, metal matrix composites, molybdenum alloys, high entropy alloys, medical device materials, and solder alloys used in electronic packaging. His research has widespread applications in aerospace, surface transportation, power generation, machinery components, medical devices, and electronic packaging. His work involves the prediction of the long-term reliability of components operating in extreme environments such as the hot section of a gas turbine system for propulsion or energy generation. His research is funded by some of these industries as well as government funding agencies.

Green’s research has been conducted under industrial and government sponsorship. His work broadly supports the field of design, rotordynamics, and tribology. The calculation of stiffness of bolted joints has become standard in classical design textbooks*. In 2006 he received the ASME highest honor, the Machine Design Award. His work on the dynamic behavior of mechanical seals operating in liquid or gas (again award winning) has been implemented into various computer codes which have been acquired by seals manufacturers, users, and research labs. For two decades he taught two continuing education courses: (1) The “Mechanical Engineering Professional Engineering Refresher,” and (2) with colleagues from BHRG, he taught and administered the course “Fluid Sealing Technology.” He served on numerous editorial boards, served on the STLE Board of Directors, and chaired two terms the Executive Committee of the ASME, Tribology Division.

Suresh Sitaraman is a Professor in the George W. Woodruff School of Mechanical Engineering, and leads the Flexible Hybrid Electronics Initiative at Georgia Tech and directs the Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab at Georgia Tech. He is a Thrust Leader/Faculty Member, Reliability/Mechanical Design Research, 3D Systems Packaging Research Center; a Faculty Member, Georgia Tech Manufacturing Institute; a Faculty Member, Interconnect and Packaging Center, an SRC Center of Excellence, Institute for Electronics and Nanotechnology; a Faculty Member, Nanoscience and Nanotechnology, Nanotechnlogy Research Center, Institute for Electronics and Nanotechnology; a Faculty Member, Institute of Materials. Dr. Suresh Sitaraman's research is exploring new approaches to develop next-generation microsystems. In particular, his research focuses on the design, fabrication, characterization, modeling and reliability of micro-scale and nano-scale structures intended for microsystems used in applications such as aerospace, automotive, computing, telecommunicating, medical, etc. Sitaraman's research is developing physics-based computational models to design flexible as well as rigid microsystems and predict their warped geometry and reliability. His virtual manufacturing tools are able to simulate sequential fabrication and assembly process mechanics to be able to enhance the overall yield, even before prototypes are built. Sitaraman's work is developing free-standing, compliant interconnect technologies that can mechanically decouple the chip from the substrate without compromising the overall electrical functionality. This work is producing single-path and multi-path interconnect technologies as well as nanowire and carbon nanotube interconnects for electrical and thermal applications, and such interconnect technologies can be employed in flexible as well as 3D microelectronic systems. Sitaraman's research is also developing innovative material characterization techniques such as the stressed super layer technique as well as magnetic actuation test that can be used to study monotonic and fatigue crack propagation in nano- and micro-scale thin film interfaces. In addition, Sitaraman has developed fundamental modeling methodologies combined with leading-edge experimentation techniques to study delamination in the dielectric material and copper interface used in back-end-of-the-line (BEOL) stacks and through-silicon vias as well as epoxy/copper and epoxy/glass interfaces as in microelectronic packaging and photovoltaic module applications. Examining the long-term operational as well as accelerated thermal cycling reliability of solder interconnects, his work has direct implications in implantable medical devices, photovoltaic modules, computers and smart devices as well as rugged automobile and aerospace applications. Through the above-mentioned fundamental and applied research and development pursuits, Sitaraman's work aims to address some of the grand challenges associated with clean energy, health care, personal mobility, security, clean environment, food and water, and sustainable infrastructure

Oliver Pierron joined Georgia Tech in summer 2007. Prior, he was a senior engineer at the R&D center of Qualcomm MEMS Technologies, Inc. in San Jose, California. Pierron's research group investigates the mechanical properties of small-scale materials with emphasis on the degradation properties (fracture, fatigue, creep). The scientific contribution of this research is to develop a fundamental understanding of the degradation mechanisms at the nanoscale while the engineering motivation is to assess and predict the structural reliability of devices and systems fabricated with emerging technologies. An underlying challenge is to develop experimental techniques that permit to accurately measure these properties. Pierron's research is currently sponsored by the National Science Foundation.