The Georgia Tech Optec Femtosecond Laser is an OPTEC WS-Flex USP system that uses a femtosecond laser to process practically any material through ultra-short laser pulses photo-ablation. The ultra-short laser pulse is effective on polymers, metals, ceramics, glass, single crystals, and polymorphic crystals. Materials are ionized by the laser pulse and removed from the surface in a plasma cloud, leaving a clean surface at the interaction site. Contrary to typical thermal laser operations, the femtosecond laser is not as sensitive to wavelength absorption and therefore offers minimum thermal, creating a no heat-affected zone on the part.

Applications include cutting, milling, drilling, tube processing, composite material cutting, scribing, and surface structuring.

System specifications are:

• 1030nm Wavelength (nm)
• Machining head: Galvo scanner, fixed lens, cutting head, and Infinite Field of View (IFOV)
• Laser type (pulse duration): picosecond, femtosecond
• Max. Scanner field: 20x20 mm
• Minimum Spot size: 6 µm for fixed head, 14µm for galvo head
• XY stages travel: 300x300 mm
• Submicron stages resolution
• Class 1 laser system (fully interlocked)