The Maskless Aligner MLA 300 provides high throughput, a simplified workflow, and integration with manufacturing execution systems. With a minimum feature size of 1.5 um, the MLA 300 can expose upto 12" wafer sizes. Real-time autofocus compensates for substrate warp or corrugations, ensuring flawless patterning. Shorter time writing for utilizing the tool from prototyping to production, with superior critical dimensions (CD) uniformity.